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LM_whiskersCALCE_151030

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PSMC
Parts Standardization & Management Committee (PSMC) Spring ConferenceMcLean, VAApril 20-22, 2010
Tin Reflow for Tin Whisker MitigationGeorge J.S. Chou* and Robert D. HiltyTyco Electronics CorporationTin Whisker Test Results for PCB Test Coupons with Immersion Tin Surface FinishDr. Martin Huehne , Natcharee Nitisantawakoop and Pakamas Ngamson - Celestica (Thailand) LimitedApplication-Specific Tin Whisker Risk Assessment Algorithm- Update 2010David Pinsky - RaytheonA Case Study of Bismuth Whiskers in a Crystal OscillatorDr. Debasis Basak, L. H. Ponce and D.El. Boyarsky - Orbital Sciences CorporationTin Whiskers: A Test Method at the Electronic Board LevelJP. Michelet, Jannick Guinet and Carlos Perez - Schneider ElectricWhisker Bridging Risk Spacing Analysis of the back side of Quad Flat PacksDr. Stephan Meschter -BAE SystemsRisk of Whisker Induced Metal Vapor ArcsDr. Henning Liedecker NASAEffectiveness of Conformal Coating in Mitigating Tin Whisker Induced FailuresSungwon Han and Michael OstermanUniversity of MarylandMeasuring the mitigation capability of Conformal Coatings: Part 2Dr. Chris Hunt and Martin Wickham - NPLTin Whisker Mitigated by Photonic Sintering for Sn-based Surface FinishesDr. Jamie Novak, Mohshi Yang, David Jiang-Applied NanotechAhmed Amin and Michael Osterman – University of MarylandResults of Mitigation Effectiveness Survey and Plans for GEIA-STD-0005-2 RevisionDr. Anduin Touw - BoeingLead-Free Manhattan Project- Tin Whiskers Gap Analysis and Research RoadmapDavid Pinsky - RaytheonTin Whisker Evaluation Status for Space ApplicationNorio Nemoto - JAXA
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development: Model andExperimentsP.T. Vianco and J.A. Rejent, Sandia National LaboratoriesInterface Flow Mechanism to Explain Tin Whisker Growth Using FIB TechnologyJing Cheng and James Li, University of RochesterP.T. Vianco, Sandia National LaboratoriesReal-time Studies of Whisker Growth : Trying to Understand the Stress, IMC and WhiskerConnectionProf. Eric Chason, Nitin Jadhav, Eric Buchovecky, Allan Bower and Sharvan KumarBrown UniversityStress and IMC growth in annealed and reflowed Sn-Cu bilayers and their relation to whiskerkineticsNitin Jadhav and Eric Chason - Brown UniversityGordon Barr-EMC CorporationA Synchrotron Micro-Diffraction Investigation of Crystallographic Texture of pure Sn, Sn-Cu, and Sn-Cu-Pb Films and its Effects on Whisker GrowthPylin Sarobol, Aaron Pedigo, John Blendell, Carol Handwerker-Purdue University; Peng Su -CiscoIndentation induced whisker formationMichael Osterman, Danny Birndt, Alex Heronime, Sungwon Han and Lyudmyla PanashchenkoUniversity of MarylandStatus whisker research efforts with JEITAProf. Katsuaki SuganumaOsaka UniversityTin Whisker Growth and the Structure Zone Model for Electroplated TinAaron Pedigo, Pylin Sarobol, John Blendell, and Carol Handwerker - Purdue UniversitySEM Observation and EBSD Analysis of Straight and Kinked Sn WhiskersDonald Susan, Joe Michael, Edward Webb III, Dick Grant, Bonnie McKenzie and Graham YeltonSandia National LaboratoriesEffect of Soldering Method, Temperature, and Humidity on Whisker Growth on Lead-free Solders in the Presence of Flux ResidueKeith Sweatman, K. Howell, J. Masuda, T. Nozu, M. Koshi and T. Nishimura -Nihon SuperiorEffects of Reflow Atmosphere and Flux on Sn Whisker Growth of Sn-Ag-Cu solderMinoru UESHIMA -Senju Metal Industry Co.,Ltd.Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma, Institute of Scientific and Industrial Research, Osaka University, Sharon Huang, Benjamin Jurcik, and Shigeyoshi NozawaAir Liquide LaboratoiresMinimization of Tin Whisker Growth for Ultra-Low Tin Whisker ApplicationsBill Sepp and Rob Schetty - Technic Inc
Center for AdvancedLife Cycle Engineering4th International Symposium on Tin WhiskersJune 23-24, 2010Samuel Riggs Alumni CenterUniversity of MarylandCollege Park, MD, USAScopeThe Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with TheInstitute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call forparticipation for the Fourth International Symposium on Tin Whiskers. Tin whiskers present a uniquechallenge to the electronics industry. There have been numbers of electronics failures in the marketcaused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics,the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys forterminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concernand research on tin whiskers particular for long life and mission critical applications, such as space,aviation, and implantable medical devices.A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finishedsurfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion,intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors andelectromigration have been shown to promote whisker formation. However, acceleration models forwhisker growth are very limited or not existent.
Listing of proceeding of prior International Symposia on Tin Whiskers can be found athttp://www.calce.umd.edu/tin-whiskers/symposia.htmContact: CALCE, University of Maryland

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